SolidRun is a leading developer and manufacturer of embedded systems and network solutions for industrial use. They focus on delivering energy-efficient, powerful and innovative products for e.g. IoT and Edge AI. We are very happy to announce that Nord Technology has entered into a distribution agreement with SolidRun in the North.

Nord Technology – a technically strong partner

The partnership has come about through an ongoing dialogue and meeting with the entire SolidRun team at the Embedded World conference. SolidRun wanted a partner who is technically strong and can provide a complete service to customers. From the initial project clarification and selection of technology and hardware, to software setup and technical support.

At Nord Technology, it is our know-how and advice that we put into play when we deliver hardware and solutions to the industrial market and to projects where hardware of particularly good quality is a necessity. We have in-depth knowledge of the use of industrial PC units in a wide variety of contexts as well as a steadily growing production department in Ballerup, Copenhagen.

SolidRun produces innovative products for IoT and industry

We look forward to expanding our distribution business with the sale of SolidRun’s products in the North and will in the near future announce more ground-breaking products from them in the Industrial PC and IoT area in particular. Products that can already be pre-ordered, specially configured as needed and with a short delivery time.

Read about SolidRun

SolidRun is known for its innovative and ground-breaking products. Here you can learn more SolidRun and their products

You can pre-order SolidRun products

If you are interested in a SolidRun product, send us an email and we will make sure that you receive ongoing information about product development and delivery times. It is also possible to pre-order.

Contact us and book a meeting:

If any questions arise, give us a call. We are always open for a chat.

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– Press release from CompuLab –

Compulab launches Tensor-I22, a configurable 11th Gen. CoreTM fanless industrial computer

October 18, 2022, Yoqneam, Israel – Compulab launches Tensor-I22, the second generation in its innovative industrial computer line, Tensor.

Tensor-I22 is based on Intel’s Tiger Lake UP3 platform and is offered with Core i7, Core i5, and Celeron processors.

Full utilization of a great platform

Intel’s Tiger Lake UP3 platform combines a high-performance CPU with a leap forward in GPU performance over previous platforms. With Inherent deep learning and AI acceleration capabilities and high-speed PCIe Gen. 4 it enables the Tensor-I22 to be a very capable computer for the contemporary needs of cutting-edge industries.

Tensor-I22 fully utilizes the capability of the platform with a wide set of peripherals that include a comprehensive back interfaces module and customizable additional interfaces.

Ready for AI

Tensor-I22 is offered with an optional pre-installed Hailo-8 AI acceleration module with enhanced heat dissipation.

This option allows the Tensor-I22 to become a strong AI edge computer, using a very efficient neural network processor for demanding computer vision missions.

Remarkable features

Tensor-I22 main features:

• Intel 11th Core processor (Tiger Lake UP3) Core i7, Core i5 or Celeron, 15W / 28W TDP
• Fanless design with modular housing (min. 20×20 cm)
• Operating temperature range up to -40°C to 70°C
• 12V – 56V input voltage
• Optional multiple industrial ports: RS-232, RS-485, CAN bus, GPIOs
• Secure boot and TPM 2.0
• 5 year warranty and 15 years of availability

Specifications

Processor: Intel Core i7-1185G7E / Core i5-1145G7E / Celeron 6305E

Memory: Up to 64GB DDR4 in 2x SO-DIMM up to 3200MT/s

Storage: Up to 3 devices: M.2 NVMe, M.2 SATA, optional 2.5” disk

Display: 4 independent displays, 2x HDMI 1.4b + 2x mini Display Port 1.2

Ethernet: Up to 4 Gigabit Ethernet ports, two of them with possibility of PoE PSE or SFP+

Wireless connectivity: Wi-Fi 6E + Bluetooth 5.2, LTE / 5G modem

USB: 2 USB 3.1 + 2 USB 2.0 as standard, with up to 8 more ports available

Serial / GPIO: Up to 20 optional RS-232 / RS-485 / CAN bus / GPIOs

Audio: Optional analog in/out

Power: 12V – 56V, 5A

TPM: Internal TPM 2.0, optional discreet TPM 2.0

Operation system support: Win 10 IoT enterprise LTSC 2021, Win 11 Pro, Linux Mint, Ubuntu

Operating Temperature: Commercial (0°C to 45°C) up to industrial (-40°C to 70°C)

Size: standard 20cm X 20cm X 3.5 cm or larger

Mounting: VESA, DIN Rail

Contact us

Contact us here for more details, availability and prices.

Email: email@nordtechnology.dk

Phone: +45 7027 0415

– Press release from CompuLab –

CompuLab introduces UCM-iMX93 – a miniature, cost-effective System-on-Module based on NXP i.MX93 processor

Yokneam, Israel 31-May-2023 – CompuLab introduces the UCM-iMX93 System-on-Module, built around the new NXP i.MX93 System-on-Chip family.

Designed to bring out the full capabilities of the i.MX93 SoC, UCM-iMX93 provides up-to 2GB RAM and 64GB eMMC, Gbit Ethernet, RGMII, 2 USB ports, 2 CAN-FD, 7 UARTs and up-to 79 GPIOs. Display connectivity is supported with LVDS and MIPI-DSI. Measuring just 28 x 38 mm, UCM-iMX93 also features on-board WiFi 802.11ac and Bluetooth 5.3 interfaces. UCM-iMX93 is offered with full industrial temperature range of -40C to 85C.

Excellent connectivity, low cost and small size make UCM-iMX93 a versatile solution for many applications such as building and industrial control, medical devices, IoT gateways and measurement equipment.

UCM-iMX93 – NXP iMX9 System-on-Module

Software Support

UCM-iMX93 er forsynet med en fuld BSP og klar til at køre billeder til Linux-operativsystemet.
UCM-iMX93 BSP inkluderer Linux-kerne 5.15.71, Yocto Project SDK og U-Boot boot-loader.

Evaluation and Design Support

To facilitate streamlined and rapid product development, UCM-iMX93 is provided with SB-UCMIMX93 carrier board and EVAL-UCM-iMX93 evaluation kit.

SB-UCMIMX93 carrier-board is designed for easy evaluation of all UCM-iMX93 functions. It also serves as reference for the customer’s carrier-board design, providing proven building blocks for all key interfaces and peripherals. SB-UCMIMX93 schematics, bill of materials and layout are available.

EVAL-UCM-iMX93 evaluation kit includes UCM-iMX93 and SB-UCMIMX93 hardware set, 5” WXGA LCD panel, PSU, cables and engineering technical support.

Specifications

• CPU NXP i.MX9352, dual-core ARM Cortex-A55, 1.7GHz
• NPU Arm® Ethos™ U-65 microNPU
• Real-Time MCU ARM Cortex-M33
• RAM Up-to 2GB LPDDR4
• Storage Up to 64GB of soldered eMMC
• Display MIPI-DSI, 4 data lanes, up to 1920 x 1080 @60Hz
  LVDS, 4 lanes, up to 1366 x 768 p60
• Camera MIPI-CSI, 2 data lanes
• Audio Up-to 2x I2S / SAI
• Network 2x Gigabit Ethernet / RGMII
  Pre-certified 802.11ac WiFi
  Bluetooth 5.3 BLE
• USB 2x USB2.0 dual-role ports
• UART Up-to 7x UART
• CAN bus Up-to 2x CAN-FD
• General I/O Up-to 2x SDIO, 6x I2C, 7x SPI, 6x PWM, 79x GPIO
• Debug JTAG debug interface
• Supply Voltage 3.45V to 4.4V
• Connectors 2 x 100 pin, 0.4mm pitch
• Dimensions 28 x 38 x 4 mm
• Temp. range -40C to 85C

Contact us

Contact us here for more details, availability and prices.

Email: email@nordtechnology.dk

Phone: +45 7027 0415

News from TAICENN

TAICENN TPC-DCT/DRT T series

– Industrial Modular Touch Panel PCs with Intel 11th Gen. Tiger Lake UP3 processors

TAICENN has launched a new modular Panel PC series, the TPC-DCT/DRT T Series. The Panel PC series is a ruggedized, cableless & flat designed. with full dimensions (from 15.0”to 21.5”) that’s to provide the most stable and reliable product solution for industrial HMI applications. As always, this new series HMI Panel PCs shares the same cut-out dimension on both Pcap. touch (TPC-DCT T series) and high temp. 5-wires resistive touch (TPC-DRT T series). It is modular designed and manufactured by the standard Pcap. and resistive touch display modules and newer computer modules.

Outstanding performance

The newest released Tiger Lake Panel PC system is powered by Intel’s 11th Gen. Intel Tiger Lake UP3 SoC based platform (Core i3-1115G4, Core i5-1135G7, Core i7-1165G7) processors for power-efficiency performance. The integrated Intel Iris Xe Graphics built with innovative GPU architecture are able to optimize image and video handling capabilities.

Wide support and possibility of multiple extensions

The new TPC-DCT/DRT T series industrial HMI embedded system support TPM2.0 (PTT2.0) and Windows 11 Operating systems, and exceptional 3 high speed expansion modules slots: 1* M.2 3042/3052 B-key slot with built-in SIM card slot to support 4G/5G/Wi-Fi6 cellular network; 1* M.2 2242 E-key to support Wi-Fi/BT wireless network and 1* Mini-PCIe slot for more requested modules or wireless expansions. It’s an ideal solution for various of industrial projects, including Machine-to-Machine (M2M), smart building automation, industrial automation, Industrial Internet of Things (IIoT), smart manufacturing, industry 4.0, commercial automation

Outstanding performance – Intel’s newest 11th Gen. Tiger Lake UP3

TPC-DCT/DRT T series industrial HMI Panel PCs adopts Intel’s newest 11th Gen. Tiger Lake UP3 chips. The 11th Gen. Intel® Core™ processors deliver a balance of performance and responsiveness in a low-power platform built on our third-generation 10nm process technology. Engineered to deliver for IoT markets, these processors can support low-latency and time-sensitive applications, and have the power to run multiple workloads including AI and deep learning applications on a single platform. (Source from Intel).

Rich IOs and expansions – More expansion to meet more industrial needs

The rugged touch Panel PC is designed with rich IO interfaces, 2* GbE, 2* USB3.0 (UBB3.2 Gen1 x1 5Gbps), 2* USB3.1 (USB3.2 Gen2 x1 10Gpbs), 2* RS232/RS422/RS485 (BIOS configured), 1* HDMI, 1* DP, Audio, 1* Optional USB type C (USB3.2 Gen2 x1 10Gbps & DP1.4a), can meet different interface requirements and help information transmission more smoothly. It is designed with 3 high speed expansion slots (1* M.2 3042/3052 Key-B, 1* M.2 2242 Key-E and 1* Mini-PCIe), can optional support 3G/4G, 5G, Wi-Fi6, Wi-Fi/BT wireless functions. Also, TPC-DCT/DRT T series provides more powerful expansion possibilities, and offer flexible and fast expansions for industrial field applications to improve product performance.

Main features:

• High strength aluminum alloy, anodized and painting treatment;
• Available: 15.0” XGA, 15.6” WXGA, 15.6” FHD, 17.0” SXGA, 18.5” WXGA, 18.5” FHD, 19.0” SXGA and 21.5” FHD;
• On-board Intel 11th Gen. Tiger Lake UP3 Core i3-1115G4, Core i5-1135G7, Core i7-1165G7 processors;
• Intel PTT TPM2.0, support to install Win11 OS;
• Support both Pcap. Touch and 5-wires resistive touch, EETI controller;
• 2* DDR4 memory, single slot, max. up to 64GB,
• 1* M.2 2280(PCIe x4 NVMe) SSD, and 1* 2.5” SATA SSD;
• Wide voltage DC 9~36V input, with over-voltage, over-current and polarity protection;
• 3 expansion slots, optional 3G/4G, 5G, Wi-Fi6, WIFI/BT support;
• 2 GLAN, 2 USB3.0, 2 USB3.1, 2 COM, 1 HDMI, 1 DP, Audio;
• Panel mount, support VESA 75/100 mounting method;
• Fanless design, Cableless & slim design, front IP65 rated protection.

Delivery plan::

The TPC-DCT/DRT T-series will be available from mid-August 2023.  

Contact us

If any questions arise, give us a call. We are always open for a chat.

Send us Email

Or contact us by phone at +45 7027 0415

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